Invention Grant
- Patent Title: Mobile payment apparatus and method
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Application No.: US15388813Application Date: 2016-12-22
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Publication No.: US11429950B2Publication Date: 2022-08-30
- Inventor: Shilin Pan
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN201510201343.9 20150424
- Main IPC: G06Q20/32
- IPC: G06Q20/32 ; G06F21/57 ; H04W4/80 ; G06Q20/38 ; G06Q20/40 ; H04L9/32 ; H04W12/08 ; H04W12/45

Abstract:
A mobile payment apparatus includes a communication unit configured to exchange payment information with a communication peer end using a radio link, a memory configured to store mobile payment software, a SE, including a first storage module and a processor, and at least one CPU configured to execute general operating system software. The processor is configured to load the mobile payment software from the memory to the first storage module and exchange the payment information with the communication unit under action of the mobile payment software. The first storage module is configured to provide memory space for executing the mobile payment software for the processor. The SE and the at least one CPU are located in a first semiconductor chip.
Public/Granted literature
- US20170103378A1 Mobile Payment Apparatus and Method Public/Granted day:2017-04-13
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