Invention Grant
- Patent Title: Multilayer balun
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Application No.: US17160559Application Date: 2021-01-28
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Publication No.: US11431071B2Publication Date: 2022-08-30
- Inventor: Yuta Ashida , Masahiro Tatematsu , Shuhei Sawaguchi , Shigemitsu Tomaki , Tetsuzo Goto , Takeshi Kijima
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-014441 20200131
- Main IPC: H01P5/10
- IPC: H01P5/10 ; H03H7/42 ; H03H7/09 ; H01P3/08 ; H01G4/30 ; H03H7/01 ; H03H1/00

Abstract:
A balun includes first to fourth lines and a stack. A plurality of first conductor layers forming the first and third lines are located in a first region in the stack. A plurality of second conductor layers forming the second and fourth lines are located in a second region in the stack. A ground conductor layer is located closer to the second region than to the first region. The plurality of second conductor layers include a conductor layer pair where a distance between two conductor layers is smallest.
Public/Granted literature
- US20210242852A1 MULTILAYER BALUN Public/Granted day:2021-08-05
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