Invention Grant
- Patent Title: Radio-frequency circuit and communication device
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Application No.: US16908820Application Date: 2020-06-23
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Publication No.: US11431304B2Publication Date: 2022-08-30
- Inventor: Shinya Hitomi , Hidenori Obiya , Hirotsugu Mori
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-121712 20190628
- Main IPC: H03F3/24
- IPC: H03F3/24 ; H03F3/19 ; H03F3/72 ; H03F3/21

Abstract:
A radio-frequency circuit includes a power amplifying circuit configured to amplify a first radio-frequency signal having a first channel bandwidth and a second radio-frequency signal having a second channel bandwidth greater than the first channel bandwidth. The power amplifying circuit is configured to amplify the first radio-frequency signal in an amplifying mode according to an envelope tracking method, and to amplify the second radio-frequency signal in an amplifying mode according to an average power tracking method.
Information query
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