Invention Grant
- Patent Title: Expansion bracket with heat dissipation for optical transceiver system
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Application No.: US17119430Application Date: 2020-12-11
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Publication No.: US11431415B2Publication Date: 2022-08-30
- Inventor: Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/40 ; G02B6/42

Abstract:
An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
Public/Granted literature
- US20220190921A1 Expansion Bracket With Heat Dissipation For Optical Transceiver System Public/Granted day:2022-06-16
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