Invention Grant
- Patent Title: Coil component
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Application No.: US16182764Application Date: 2018-11-07
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Publication No.: US11437183B2Publication Date: 2022-09-06
- Inventor: Seung Hee Oh , Tae Jun Choi , Tai Yon Cho , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0038077 20180402
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00 ; H01F41/04 ; H05K1/18 ; H01F27/28 ; H01F27/36

Abstract:
A coil component includes a body, a coil part including a coil pattern and embedded in the body, an external electrode disposed on an external surface of the body and electrically connected to the coil part, a shielding layer disposed on the external surface of the body, and a ceramic insulating layer disposed on a surface of the shielding layer.
Public/Granted literature
- US20190304664A1 COIL COMPONENT Public/Granted day:2019-10-03
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