Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17167332Application Date: 2021-02-04
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Publication No.: US11437500B2Publication Date: 2022-09-06
- Inventor: Shunpei Yamazaki , Hideomi Suzawa , Shinya Sasagawa , Motomu Kurata , Masashi Tsubuku
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP2012-203385 20120914
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/786 ; H01L21/02 ; H01L27/12 ; H01L27/146

Abstract:
The on-state characteristics of a transistor are improved and thus, a semiconductor device capable of high-speed response and high-speed operation is provided. A highly reliable semiconductor device showing stable electric characteristics is made. The semiconductor device includes a transistor including a first oxide layer; an oxide semiconductor layer over the first oxide layer; a source electrode layer and a drain electrode layer in contact with the oxide semiconductor layer; a second oxide layer over the oxide semiconductor layer; a gate insulating layer over the second oxide layer; and a gate electrode layer over the gate insulating layer. An end portion of the second oxide layer and an end portion of the gate insulating layer overlap with the source electrode layer and the drain electrode layer.
Public/Granted literature
- US20210305413A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-09-30
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