- 专利标题： Acoustic wave device and method of manufacturing the same
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申请号： US15972499申请日： 2018-05-07
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公开(公告)号： US11437563B2公开(公告)日： 2022-09-06
- 发明人: Seung Wook Park , Jae Hyun Jung , Seong Hun Na
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2017-0090196 20170717,KR10-2017-0110130 20170830
- 主分类号： H03H9/64
- IPC分类号： H03H9/64 ; H01L41/09 ; H01L41/23 ; H01L41/053 ; H03H9/05 ; H03H9/10
摘要：
An acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.
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