Invention Grant
- Patent Title: Memory device and methods of making such a memory device
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Application No.: US16836434Application Date: 2020-03-31
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Publication No.: US11437568B2Publication Date: 2022-09-06
- Inventor: Yanping Shen , Haiting Wang , Sipeng Gu
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L27/22 ; G11C11/16 ; H01L43/12

Abstract:
One illustrative memory cell disclosed herein includes at least one layer of insulating material having a first opening and an internal sidewall spacer positioned within the first opening, wherein the internal sidewall spacer includes a spacer opening. The memory cell also includes a bottom electrode positioned within the spacer opening, a memory state material positioned above an upper surface of the bottom electrode and above an upper surface of the internal sidewall spacer, and a top electrode positioned above the memory state material.
Public/Granted literature
- US20210305495A1 MEMORY DEVICE AND METHODS OF MAKING SUCH A MEMORY DEVICE Public/Granted day:2021-09-30
Information query
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