Invention Grant
- Patent Title: Method of manufacturing a field effect transistor using carbon nanotubes and a field effect transistor
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Application No.: US16940321Application Date: 2020-07-27
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Publication No.: US11437594B2Publication Date: 2022-09-06
- Inventor: Timothy Vasen , Mark Van Dal , Gerben Doornbos , Matthias Passlack
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L51/05
- IPC: H01L51/05 ; H01L27/28 ; H01L51/00

Abstract:
In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.
Information query
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