Invention Grant
- Patent Title: Expansion device and movable body
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Application No.: US16493428Application Date: 2018-01-25
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Publication No.: US11440182B2Publication Date: 2022-09-13
- Inventor: Yasunori Kawanami
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2017-085999 20170425
- International Application: PCT/JP2018/002179 WO 20180125
- International Announcement: WO2018/198452 WO 20181101
- Main IPC: B25J9/10
- IPC: B25J9/10 ; B25J18/02 ; B25J17/00 ; B25J19/02

Abstract:
To provide an expansion device and a movable body including a mechanism for quick deformation. An expansion device includes a main body and a limb portion attached to the main body, in which the limb portion includes a main link connected to the main body via a joint, an end link provided at a front end of the limb portion, at least one or more limb joints that are interposed between the main link and the end link and connect the main link and the end link, and a linear member of which both ends couple an end at the front end side of the limb portion of the end link and the main body and are retractable to one or both of the end link and the main body.
Information query
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