Invention Grant
- Patent Title: Fingerprint identification module, manufacturing method thereof and electronic device
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Application No.: US16966394Application Date: 2020-01-17
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Publication No.: US11442583B2Publication Date: 2022-09-13
- Inventor: Wenqu Liu , Xiufeng Li , Qi Yao , Feng Zhang , Liwen Dong , Zhao Cui , Chuanxiang Xu , Detian Meng , Xiaoxin Song , Libo Wang , Yang Yue , Dongfei Hou , Zhijun Lv
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN201910082585.9 20190128,WOPCT/CN2019/105749 20190912
- International Application: PCT/CN2020/072849 WO 20200117
- International Announcement: WO2020/156257 WO 20200806
- Main IPC: G06F3/043
- IPC: G06F3/043 ; H01L41/04 ; H01L41/047 ; H01L41/083 ; H01L41/113 ; H01L41/27 ; G06F3/044 ; G06F3/041 ; G06V40/13 ; G06V40/12

Abstract:
A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. In the fingerprint identification module, an auxiliary structure is at least partially located on a functional substrate, and a plurality of first driving electrodes are on a side, away from the functional substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer.
Public/Granted literature
- US20210200985A1 FINGERPRINT IDENTIFICATION MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE Public/Granted day:2021-07-01
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