- 专利标题： Substrate assembly with encapsulated magnetic feature
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申请号： US16020035申请日： 2018-06-27
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公开(公告)号： US11443892B2公开(公告)日： 2022-09-13
- 发明人: Kyu-Oh Lee , Rahul Jain , Sai Vadlamani , Cheng Xu , Ji Yong Park , Junnan Zhao , Seo Young Kim
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L27/32
- IPC分类号： H01L27/32 ; H01F27/32 ; H01L23/498 ; H01F41/04 ; H01L21/48 ; H01F27/28 ; H01L21/683 ; H01L23/00
摘要：
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
公开/授权文献
- US20200005994A1 SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE 公开/授权日：2020-01-02
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