Invention Grant
- Patent Title: Coil component
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Application No.: US16783540Application Date: 2020-02-06
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Publication No.: US11443894B2Publication Date: 2022-09-13
- Inventor: Dong Hwan Lee , Chan Yoon , Dong Jin Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0086176 20190717
- Main IPC: H01F27/36
- IPC: H01F27/36 ; H01F27/28 ; H01F41/04 ; H01F27/32 ; H01F27/29 ; H01F27/24

Abstract:
A coil component includes a body, a support substrate buried in the body, a coil portion disposed on at least one surface of the support substrate and having both ends exposed to a surface of the body, a noise removing portion disposed on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop such that one end of the noise removing portion is exposed to a surface of the body, an insulating layer disposed between the coil portion and the noise removing portion, first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively, and a third external electrode disposed on a surface of the body and connected to the one end of the noise removing portion.
Public/Granted literature
- US20210020359A1 COIL COMPONENT Public/Granted day:2021-01-21
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