Invention Grant
- Patent Title: Manufacturing method for array substrate
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Application No.: US16618909Application Date: 2019-11-12
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Publication No.: US11443945B2Publication Date: 2022-09-13
- Inventor: Jinyang Zhao
- Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Benesch, Friedlander, Coplan & Aronoff, LLP
- Priority: CN201910327454.2 20190423
- International Application: PCT/CN2019/117438 WO 20191112
- International Announcement: WO2020/215677 WO 20201029
- Main IPC: H01L21/71
- IPC: H01L21/71 ; H01L21/02 ; H01L27/12 ; H01L21/20 ; H01L21/77 ; H01L21/768

Abstract:
The present invention provides a manufacturing method of an array substrate, including steps of: providing a flexible substrate layer, forming a buffer layer, forming an active layer, forming a gate insulating layer, forming a gate layer, forming an interlayer insulating layer, forming a source and drain layer, forming an organic planarization layer, forming an anode layer. An array substrate manufactured by the above manufacturing method, and the array substrate includes laminated a flexible substrate layer, a buffer layer, an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source and drain layer, an organic planarization layer, and an anode layer, which are disposed in a stack.
Public/Granted literature
- US20220005841A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-01-06
Information query
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