Invention Grant
- Patent Title: Packaged electronic device with split die pad in robust package substrate
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Application No.: US16831503Application Date: 2020-03-26
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Publication No.: US11444012B2Publication Date: 2022-09-13
- Inventor: Yuh-Harng Chien , Chang-Yen Ko , Chih-Chien Ho
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L25/00
Abstract:
In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.
Public/Granted literature
- US20210305139A1 PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST PACKAGE SUBSTRATE Public/Granted day:2021-09-30
Information query
IPC分类:
