Invention Grant
- Patent Title: Package structure with separated street between chips
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Application No.: US17152806Application Date: 2021-01-20
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Publication No.: US11444058B2Publication Date: 2022-09-13
- Inventor: Chien-Chen Ko , Teng-Jui Yu , Wei-Kang Tsai
- Applicant: NOVATEK Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: NOVATEK Microelectronics Corp.
- Current Assignee: NOVATEK Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/528 ; H01L23/544
Abstract:
A package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip.
Public/Granted literature
- US20220149006A1 PACKAGE STRUCTURE Public/Granted day:2022-05-12
Information query
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