- 专利标题: Method of forming uniform fin features
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申请号: US16988712申请日: 2020-08-09
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公开(公告)号: US11444180B2公开(公告)日: 2022-09-13
- 发明人: Ying-Cheng Chuang
- 申请人: NANYA TECHNOLOGY CORPORATION
- 申请人地址: TW New Taipei
- 专利权人: NANYA TECHNOLOGY CORPORATION
- 当前专利权人: NANYA TECHNOLOGY CORPORATION
- 当前专利权人地址: TW New Taipei
- 代理机构: CKC & Partners Co., LLC
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/8234
摘要:
A method for forming a semiconductor structure includes: providing a structure including a substrate and a target layer disposed on the substrate, and the target layer includes a central area and a periphery area; forming a plurality of linear fin features within the central area in which the linear fin features are substantially parallel to each other and include edge imbalance portions; and removing the edge imbalance portions of the linear fin features to obtain linear uniform fin features.
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