- 专利标题: Printed circuit board assembly
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申请号: US17210406申请日: 2021-03-23
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公开(公告)号: US11445610B2公开(公告)日: 2022-09-13
- 发明人: Chang Min Seo , Yong Jae Kim , Dae Hyun Jang
- 申请人: SOLUM CO., LTD.
- 申请人地址: KR Yongin-si
- 专利权人: SOLUM CO., LTD.
- 当前专利权人: SOLUM CO., LTD.
- 当前专利权人地址: KR Yongin-si
- 代理机构: Steinfl + Bruno LLP
- 优先权: KR10-2020-0088155 20200716,KR10-2021-0001416 20210106
- 主分类号: H05K1/14
- IPC分类号: H05K1/14
摘要:
A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB.
公开/授权文献
- US20220022319A1 PRINTED CIRCUIT BOARD ASSEMBLY 公开/授权日:2022-01-20
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