Invention Grant
- Patent Title: Package and buffer tool
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Application No.: US17036545Application Date: 2020-09-29
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Publication No.: US11447323B2Publication Date: 2022-09-20
- Inventor: Naruki Kataoka , Tatsuya Kojima
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-185189 20191008
- Main IPC: B65D81/02
- IPC: B65D81/02 ; B65D81/05 ; B65D85/672

Abstract:
A package includes a storage portion that stores an object to be stored, and a buffer portion that reduces a gap generated between the object to be stored and the storage portion. The storage portion includes a bottom and a lid facing the bottom, and the buffer portion includes a base facing the object to be stored in a stacking direction from the bottom toward the lid, a first fold, and a space adjusting portion connected to the base at the first fold. The space adjusting portion includes an adjusting region extending in the stacking direction, a plurality of second folds distributed in a first direction intersecting the first fold, and a contact region connected to the adjusting region at one of the plurality of second folds.
Public/Granted literature
- US20210101732A1 PACKAGE AND BUFFER TOOL Public/Granted day:2021-04-08
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