Invention Grant
- Patent Title: Backlight module including adhesive structure and electronic device including the same
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Application No.: US17466072Application Date: 2021-09-03
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Publication No.: US11448812B1Publication Date: 2022-09-20
- Inventor: Fu Kuo , May Pan , Maggy Hsu , Lavender Cheng
- Applicant: Fu Kuo , May Pan , Maggy Hsu , Lavender Cheng
- Applicant Address: TW Tainan; TW Tainan; TW Magong; TW Tainan
- Assignee: Fu Kuo,May Pan,Maggy Hsu,Lavender Cheng
- Current Assignee: Fu Kuo,May Pan,Maggy Hsu,Lavender Cheng
- Current Assignee Address: TW Tainan; TW Tainan; TW Magong; TW Tainan
- Agency: Patterson + Sheridan, LLP
- Main IPC: F21V8/00
- IPC: F21V8/00 ; G02F1/1333 ; G02F1/1335

Abstract:
A backlight module is provided. The backlight module includes a circuit board and a plurality of light-emitting elements arranged on the circuit board along a first direction. The backlight module includes an adhesive structure disposed on the circuit board. The adhesive structure has a plurality of segmented elements separated from each other. One of the segmented elements has a first part and a second part. The second part is connected with the first part. The first part is disposed between adjacent light-emitting elements. The backlight module further includes a light guide plate disposed on the circuit board and attached to the second part. A first width is a maximum width of the first part in the first direction, a second width is a maximum width of the second part in the first direction. The second width is greater than the first width.
Information query