- 专利标题： Arrangement of bond pads on an integrated circuit chip
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申请号： US17175275申请日： 2021-02-12
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公开(公告)号： US11450635B2公开(公告)日： 2022-09-20
- 发明人: Chia-Chi Hsu
- 申请人： Changxin Memory Technologies, Inc.
- 申请人地址： CN Anhui
- 专利权人： Changxin Memory Technologies, Inc.
- 当前专利权人： Changxin Memory Technologies, Inc.
- 当前专利权人地址： CN Anhui
- 代理机构： Sheppard Mullin Richter & Hampton LLP
- 优先权： CN201811011188.4 20180831,CN201821427834.0 20180831
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
The embodiments of the present invention discloses an arrangement of bond pads on an integrated circuit chip. The integrated circuit chip includes: a first row of bond pads; and a second row of bond pads, wherein bond pads in the first row are positioned alternately with bond pads in the second row, and a short side of the bond pads in the first row and the second row is parallel to a long side of the integrated circuit chip. With this arrangement of bond pads on the integrated circuit chip, the bond pads may occupy a reduced area of a surface of the integrated circuit chip.
公开/授权文献
- US20210167028A1 ARRANGEMENT OF BOND PADS ON AN INTEGRATED CIRCUIT CHIP 公开/授权日：2021-06-03
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