发明授权
- 专利标题: Camera module and molding circuit board assembly, circuit board and application thereof
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申请号: US17314723申请日: 2021-05-07
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公开(公告)号: US11451693B2公开(公告)日: 2022-09-20
- 发明人: Mingzhu Wang , Duanliang Cheng , Fengsheng Xi , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhenyu Chen , Nan Guo
- 申请人: Ningbo Sunny Opotech Co., Ltd.
- 申请人地址: CN Zhejiang
- 专利权人: Ningbo Sunny Opotech Co., Ltd.
- 当前专利权人: Ningbo Sunny Opotech Co., Ltd.
- 当前专利权人地址: CN Zhejiang
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: CN201710064137.7 20170204
- 主分类号: H04N5/225
- IPC分类号: H04N5/225 ; H05K1/18 ; H05K3/30
摘要:
The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
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