Invention Grant
- Patent Title: Thermally insulated printed circuit board
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Application No.: US16522170Application Date: 2019-07-25
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Publication No.: US11452198B2Publication Date: 2022-09-20
- Inventor: Lathom Alexander Louco
- Applicant: BorgWarner, Inc.
- Applicant Address: US MI Auburn Hills
- Assignee: BorgWarner, Inc.
- Current Assignee: BorgWarner, Inc.
- Current Assignee Address: US MI Auburn Hills
- Agency: Reising Ethington P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K7/14

Abstract:
A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; and a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components.
Public/Granted literature
- US20210029817A1 THERMALLY INSULATED PRINTED CIRCUIT BOARD Public/Granted day:2021-01-28
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