Invention Grant
- Patent Title: Housing and electronic device including the same
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Application No.: US17152076Application Date: 2021-01-19
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Publication No.: US11452220B2Publication Date: 2022-09-20
- Inventor: Chongkun Cho , Sunggun Cho , Wonhee Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2019-0013460 20190201
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02

Abstract:
A housing of an electronic device and an electronic device are provided. The housing of an electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member comprising a second surface being substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface comprises a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed in from the first surface by a predetermined depth, and a second recess formed in from the first surface deeper than the first recess.
Public/Granted literature
- US20210144866A1 HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2021-05-13
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