Conventional atomic layer deposition technology is modified to increase its cost-effective viability for use in producing thinly coated flexible packaging film. In one embodiment a thinly coated flexible substrate, e.g., a polyolefin film, is made by a process comprising the steps of: (A) Dissolving a self-limiting precursor in a solvent to form a solution of dissolved self-limiting precursor in the solvent, (B) Applying the solution to a facial surface of a flexible polymer film so that at least a portion of the dissolved self-limiting precursor attaches to the facial surface of the film and the solution is at least partially depleted of self-limiting precursor, and (C) Curing the attached self-limiting precursor by contact with oxygen.