- 专利标题： Semiconductor structure, package structure, and manufacturing method thereof
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申请号： US17031913申请日： 2020-09-25
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公开(公告)号： US11456251B2公开(公告)日： 2022-09-27
- 发明人: Wei-Ting Chen , Chung-Hao Tsai , Chen-Hua Yu , Chuei-Tang Wang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/528
- IPC分类号： H01L23/528 ; H01L23/522 ; H01L23/48 ; H01L25/16 ; H01L23/00 ; H01L21/56
摘要：
A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.
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