Invention Grant
- Patent Title: Structure and method to provide conductive field plate over gate structure
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Application No.: US17029446Application Date: 2020-09-23
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Publication No.: US11456364B2Publication Date: 2022-09-27
- Inventor: Ketankumar H. Tailor , Peter Baars , Ruchil K. Jain
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/49 ; H01L29/78 ; H01L29/06

Abstract:
Embodiments of the disclosure provide an integrated circuit device and related methods. The disclosure may provide a transistor device, including: a gate structure; a drain extension region extending laterally from partially under the gate structure to a drain region; and a gate spacer located over the drain extension region. A silicide-blocking layer is over and in contact with the gate spacer. The silicide-blocking layer has a first end over the gate structure and a second, opposing end over the drain extension region. The structure also provides a conductive field plate, including a conductive layer over and in contact with the silicide-blocking layer. A field plate contact is formed on the conductive field plate.
Public/Granted literature
- US20220093751A1 STRUCTURE AND METHOD TO PROVIDE CONDUCTIVE FIELD PLATE OVER GATE STRUCTURE Public/Granted day:2022-03-24
Information query
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