- 专利标题: Semiconductor device and method
-
申请号: US16861710申请日: 2020-04-29
-
公开(公告)号: US11456373B2公开(公告)日: 2022-09-27
- 发明人: Chia-Ling Chan , Liang-Yin Chen , Wei-Ting Chien
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/324
- IPC分类号: H01L21/324 ; H01L29/66 ; H01L29/78 ; H01L21/308 ; H01L21/02 ; H01L21/306 ; H01L21/265
摘要:
In an embodiment, a device includes: a fin on a substrate, fin having a Si portion proximate the substrate and a SiGe portion distal the substrate; a gate stack over a channel region of the fin; a source/drain region adjacent the gate stack; a first doped region in the SiGe portion of the fin, the first doped region disposed between the channel region and the source/drain region, the first doped region having a uniform concentration of a dopant; and a second doped region in the SiGe portion of the fin, the second doped region disposed under the source/drain region, the second doped region having a graded concentration of the dopant decreasing in a direction extending from a top of the fin to a bottom of the fin.
公开/授权文献
- US20200259001A1 Semiconductor Device and Method 公开/授权日:2020-08-13
信息查询
IPC分类: