Invention Grant
- Patent Title: System and method for high voltage isolation with thermal conductivity
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Application No.: US17066391Application Date: 2020-10-08
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Publication No.: US11457546B2Publication Date: 2022-09-27
- Inventor: Richard P. Dube , Mark S. Langelier , Paul A. Sefcsik, Jr. , Jason P. Rosa , Curtis B. Carlsten , Michael F. Janik , Mark R. Franklin, Jr.
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.
Public/Granted literature
- US20220117110A1 SYSTEM AND METHOD FOR HIGH VOLTAGE ISOLATION WITH THERMAL CONDUCTIVITY Public/Granted day:2022-04-14
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