- 专利标题： System and method for high voltage isolation with thermal conductivity
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申请号： US17066391申请日： 2020-10-08
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公开(公告)号： US11457546B2公开(公告)日： 2022-09-27
- 发明人: Richard P. Dube , Mark S. Langelier , Paul A. Sefcsik, Jr. , Jason P. Rosa , Curtis B. Carlsten , Michael F. Janik , Mark R. Franklin, Jr.
- 申请人： Raytheon Company
- 申请人地址： US MA Waltham
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： US MA Waltham
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.
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