Invention Grant
- Patent Title: Endoscopic full thickness resection device
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Application No.: US16408926Application Date: 2019-05-10
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Publication No.: US11457973B2Publication Date: 2022-10-04
- Inventor: Michael Y. Ko , John A. Hingston , Andrew Horowitz , Kevin Windheuser
- Applicant: Boston Scientific Scimed, Inc.
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Seager, Tufte & Wickhem, LLP
- Main IPC: A61B18/00
- IPC: A61B18/00 ; A61B18/14

Abstract:
The present disclosure relates generally to devices and methods for full thickness tissue resection of an organ (e.g., intestine). In some embodiments, a device includes a conduit, and a plurality of arms rotatably coupled to the conduit. Each of the plurality of arms is movable between a collapsed position and an expanded position, wherein the plurality of arms extends radially outward from the conduit in the expanded position. The device may further include an electrocautery wire coupled to each of the plurality of arms, the electrocautery wire positioned directly adjacent an exterior tissue wall when the plurality of arms is in the expanded position. The device may be advanced back in towards a lumen of the organ until a targeted section of tissue is cut by the electrocautery wire and removed.
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