Invention Grant
- Patent Title: Hollow polymer particles for thermal insulation
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Application No.: US16340183Application Date: 2017-10-06
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Publication No.: US11459438B2Publication Date: 2022-10-04
- Inventor: Lily Liu , Daniel E. Stark , Wayne Devonport , Donovan K. Lujan
- Applicant: Arkema Inc.
- Applicant Address: US PA King of Prussia
- Assignee: Arkema Inc.
- Current Assignee: Arkema Inc.
- Current Assignee Address: US PA King of Prussia
- Agent Lynn B. Morreale
- International Application: PCT/US2017/055557 WO 20171006
- International Announcement: WO2018/071300 WO 20180419
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B29C70/66 ; C08J9/32 ; B29C44/34 ; B29K105/00

Abstract:
A thermal insulating additive, product formed therefrom, and method of making the same, wherein the thermal insulating additive comprises a plurality of hollow polymeric particles having an average particle size up to about 0.3 micrometers. The hollow polymeric particles exhibit a mechanical strength in a compression test up to about 420 psi and a thermal conductivity that is less than 0.150 W/m-k. The hollow polymeric particles are individually formed as an alkaline swellable core that is at least partially encapsulated with two or more shell layers; the alkaline swellable core prior to swelling exhibits an average particle size that is less than about 50 nanometers.
Public/Granted literature
- US20190309140A1 HOLLOW POLYMER PARTICLES FOR THERMAL INSULATION Public/Granted day:2019-10-10
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