Invention Grant
- Patent Title: Semiconductor device structure with fine boron nitride spacer patterns and method for forming the same
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Application No.: US16942049Application Date: 2020-07-29
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Publication No.: US11462406B2Publication Date: 2022-10-04
- Inventor: Pei Cheng Fan
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/033
- IPC: H01L21/033

Abstract:
The present disclosure provides a semiconductor device structure with fine boron nitride spacer patterns and a method for forming the semiconductor device structure, which can prevent the collapse of the fine patterns. The semiconductor device structure includes a first target structure and a second target structure disposed over a semiconductor substrate. The semiconductor device structure also includes a first boron nitride spacer disposed over the first target structure, wherein a topmost point of the first boron nitride spacer is between a central line of the first target structure and a central line of the second target structure in a cross-sectional view.
Public/Granted literature
- US20220037155A1 SEMICONDUCTOR DEVICE STRUCTURE WITH FINE BORON NITRIDE SPACER PATTERNS AND METHOD FOR FORMING THE SAME Public/Granted day:2022-02-03
Information query
IPC分类: