Invention Grant
- Patent Title: Sensor package substrate, sensor module including the same, and electronic component embedded substrate
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Application No.: US16550995Application Date: 2019-08-26
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Publication No.: US11462447B2Publication Date: 2022-10-04
- Inventor: Kazutoshi Tsuyutani , Yoshihiro Suzuki , Akira Motohashi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-133591 20180713
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L25/18 ; H01L23/538 ; G01L9/00 ; G01H3/00 ; G01K13/02 ; G01N33/00 ; G01K13/024
Abstract:
A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
Public/Granted literature
- US20200161199A1 SENSOR PACKAGE SUBSTRATE, SENSOR MODULE INCLUDING THE SAME, AND ELECTRONIC COMPONENT EMBEDDED SUBSTRATE Public/Granted day:2020-05-21
Information query
IPC分类:
