- Patent Title: Semiconductor package device and method of manufacturing the same
-
Application No.: US16262762Application Date: 2019-01-30
-
Publication No.: US11462455B2Publication Date: 2022-10-04
- Inventor: Shiu-Fang Yen , Chang-Lin Yeh , Jen-Chieh Kao
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/367 ; H01L23/00 ; H01L23/31 ; H01L23/373 ; H01L23/498 ; H01L23/66 ; H01L21/48 ; H01L21/56 ; H01Q1/38 ; H01L25/065
Abstract:
A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.
Public/Granted literature
- US20190393126A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-12-26
Information query
IPC分类:
