Invention Grant
- Patent Title: Lead frame, package structure comprising the same and method for manufacturing the package structure
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Application No.: US16929018Application Date: 2020-07-14
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Publication No.: US11462467B2Publication Date: 2022-10-04
- Inventor: Chia Hsiu Huang , Chun Chen Chen , Wei Chih Cho , Shao-Lun Yang , Yu-Shun Hsieh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/31 ; H01L23/00 ; H01L23/495
Abstract:
A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.
Public/Granted literature
- US20220020680A1 LEAD FRAME, PACKAGE STRUCTURE COMPRISING THE SAME AND METHOD FOR MANUFACTURING THE PACKAGE STRUCTURE Public/Granted day:2022-01-20
Information query
IPC分类:
