- Patent Title: Display module having LED packages including connection substrate
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Application No.: US16886128Application Date: 2020-05-28
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Publication No.: US11462523B2Publication Date: 2022-10-04
- Inventor: Jinhee Kang , Taesoon Park , Youngki Jung , Chulgyu Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0090374 20190725
- Main IPC: H01L31/036
- IPC: H01L31/036 ; H01L29/15 ; H01L29/04 ; H01L27/14 ; H01L25/16 ; H01L25/075 ; H01L33/62

Abstract:
A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.
Public/Granted literature
- US20210028156A1 DISPLAY MODULE HAVING LED PACKAGES AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-28
Information query
IPC分类: