Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16990089Application Date: 2020-08-11
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Publication No.: US11462634B2Publication Date: 2022-10-04
- Inventor: Koji Tanaka , Ryuji Ueno , Masahiro Ujike
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-202087 20191107
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/08 ; H01L29/66

Abstract:
An object of the present invention is to provide a semiconductor device capable of reducing the on-voltage and a manufacturing method thereof. According to the present invention, a semiconductor device includes a Si substrate, a p-type anode layer provided on the front surface of the Si substrate, an anode electrode provided on the p-type anode layer, an n-type cathode layer and a p-type cathode layer provided adjacent to each other on a back surface of the Si substrate, an Al alloy layer provided on the n-type cathode layer and containing Si, and an Al alloy layer provided on the p-type cathode layer and containing Si, in which impurity concentration in the n-type cathode layer is 1E19 cm−3 or higher and impurity concentration in the p-type cathode layer is 10% or lower of the impurity concentration in the n-type cathode layer.
Public/Granted literature
- US20210143269A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-05-13
Information query
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