中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US11462740B2 Conductive material paste for electrochemical device, slurry composition for electrochemical device positive electrode and method of producing same, positive electrode for electrochemical device, and electrochemical device 有权

  • Patent Title: Conductive material paste for electrochemical device, slurry composition for electrochemical device positive electrode and method of producing same, positive electrode for electrochemical device, and electrochemical device
  • Application No.: US16765870
    Application Date: 2018-11-29
  • Publication No.: US11462740B2
    Publication Date: 2022-10-04
  • Inventor: Shinsuke Sugawara , Maki Mesuda , Tomoya Murase
  • Applicant: ZEON CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: ZEON CORPORATION
  • Current Assignee: ZEON CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: Kenja IP Law PC
  • Priority: JPJP2017-230483 20171130
  • International Application: PCT/JP2018/043894 WO 20181129
  • International Announcement: WO2019/107463 WO 20190606
  • Main IPC: H01M4/62
  • IPC: H01M4/62 ;  H01M4/36 ;  H01M10/0525 ;  H01M4/02
Conductive material paste for electrochemical device, slurry composition for electrochemical device positive electrode and method of producing same, positive electrode for electrochemical device, and electrochemical device
Abstract:
A conductive material paste for an electrochemical device contains a conductive material, an imidazole compound represented by the following formula (I), a binder, and an organic solvent. In formula (I), X1 and X2 are each hydrogen or a monovalent organic group that optionally forms a ring structure, and X3 and X4 are each hydrogen or an independent monovalent organic group.
Information query
Espacenet
Patent Agency Ranking
0/0