- Patent Title: Electronic device including conductive structure connecting electrically ground layer of flexible printed circuit board and ground layer of printed circuit board
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Application No.: US16659970Application Date: 2019-10-22
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Publication No.: US11462846B2Publication Date: 2022-10-04
- Inventor: Seunghan Seo , Jongpil Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2018-0126469 20181023
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01R12/77 ; H01Q21/06 ; H01R12/79 ; H01Q5/314 ; H01R12/62

Abstract:
According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.
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