Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17008673Application Date: 2020-09-01
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Publication No.: US11463116B2Publication Date: 2022-10-04
- Inventor: Yoichi Sawada , Takayuki Shinozaki , Yukiya Yamaguchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-171752 20190920,JPJP2020-057259 20200327
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F3/24 ; H03F1/56

Abstract:
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
Public/Granted literature
- US20210091800A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-03-25
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