- 专利标题： Systems and methods for wafer-level testing of transmitter-receiver links
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申请号： US17443381申请日： 2021-07-26
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公开(公告)号： US11463173B1公开(公告)日： 2022-10-04
- 发明人: Xingyu Zhang , Dawei Zheng , Tongqing Wang , Zhoufeng Ying
- 申请人： Alpine Optoelectronics, Inc.
- 申请人地址： US CA Fremont
- 专利权人： Alpine Optoelectronics, Inc.
- 当前专利权人： Alpine Optoelectronics, Inc.
- 当前专利权人地址： US CA Fremont
- 代理机构： Cionca IP Law P.C.
- 代理商 Marin Cionca
- 主分类号： H04B10/40
- IPC分类号： H04B10/40 ; G02B6/42
摘要：
An integrated transceiver chip comprising: a plurality of bidirectional ports; a plurality of grating couplers; a receiver having a first and a second input ports, the first input port being optically connected to a first grating coupler of the plurality of grating couplers, and the second input port being optically connected to a first bidirectional port of the plurality of bidirectional ports; and a transmitter having a first and a second input and a first and a second output ports, the first input port being optically connected to a second bidirectional port of the plurality of bidirectional ports and the second input port being optically connected to a second grating coupler, and the first output port being optically connected to a third bidirectional port of the plurality of bidirectional ports and the second output port being optically connected to a third grating coupler of the plurality of grating couplers.
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