A subscriber identity module (SIM) card includes a housing, a printed circuit board contained within the housing, and a plurality of metallic contact pads on a surface of the printed circuit board. At least one contact pad of the plurality of metallic contact pads comprises an enclosed, interior portion. The SIM card further includes a corrosive chemical agent contained within the interior portion. The corrosive chemical agent reacts chemically with the at least one metallic contact pad, in the presence of oxygen, to cause the at least one metallic contact pad to corrode over a period of time.