- 专利标题: Inductor and transmission line with air gap
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申请号: US16024675申请日: 2018-06-29
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公开(公告)号: US11469189B2公开(公告)日: 2022-10-11
- 发明人: Kevin Lin
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L23/66
- IPC分类号: H01L23/66 ; H01L23/528 ; H01L23/532 ; H01L23/522 ; H01L21/768 ; H01L21/311 ; H01L49/02
摘要:
An integrated circuit structure comprises one or more sets of first and second conductive lines along a same direction in an interlayer dielectric (ILD), the first and second conductive lines having a width greater than 2 μm. An air gap is in the ILD between the first and second conductive lines, the air gap extending across the ILD to sidewalls of the first and second conductive lines.
公开/授权文献
- US20200006261A1 INDUCTOR AND TRANSMISSION LINE WITH AIR GAP 公开/授权日:2020-01-02
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