Invention Grant
- Patent Title: Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus
-
Application No.: US16662439Application Date: 2019-10-24
-
Publication No.: US11471996B2Publication Date: 2022-10-18
- Inventor: Seungchul Han , Yonghee Lee , Taemin Earmme , Byoungho Kwon , Kuntack Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0051237 20190502
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B37/20
Abstract:
A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.
Public/Granted literature
Information query
