Invention Grant
- Patent Title: Insert molding method and insert molding component
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Application No.: US16150817Application Date: 2018-10-03
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Publication No.: US11472079B2Publication Date: 2022-10-18
- Inventor: Takanori Ishihama , Toshiya Kuno
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2017-194990 20171005
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C45/14 ; B29C45/00 ; B65D1/40 ; B29L31/34

Abstract:
An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.
Public/Granted literature
- US20190105820A1 INSERT MOLDING METHOD AND INSERT MOLDING COMPONENT Public/Granted day:2019-04-11
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