- 专利标题: Self-rising board molding
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申请号: US16594279申请日: 2019-10-07
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公开(公告)号: US11472132B2公开(公告)日: 2022-10-18
- 发明人: Andrea Piana , Andy Hollis , Mehran Jafari , Helias Andriessen , Sang-hoon Lim , Eric McCann
- 申请人: Piana Nonwovens, LLC.
- 申请人地址: US GA Cartersville
- 专利权人: Piana Nonwovens, LLC.
- 当前专利权人: Piana Nonwovens, LLC.
- 当前专利权人地址: US GA Cartersville
- 代理机构: WC&F IP
- 主分类号: B29C70/34
- IPC分类号: B29C70/34 ; B29C70/12 ; B29C70/54 ; B29L31/00 ; B29K267/00
摘要:
Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.
公开/授权文献
- US20200298506A1 SELF-RISING BOARD MOLDING 公开/授权日:2020-09-24
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