Invention Grant
- Patent Title: Heterodimeric antibodies that bind ENPP3 and CD3
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Application No.: US16805453Application Date: 2020-02-28
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Publication No.: US11472890B2Publication Date: 2022-10-18
- Inventor: Rumana Rashid , Umesh S. Muchhal , Gregory Moore , Alex Nisthal , Seung Chu , Sung-Hyung Lee , Yoon Kyung Kim
- Applicant: Xencor, Inc.
- Applicant Address: US CA Monrovia
- Assignee: Xencor, Inc.
- Current Assignee: Xencor, Inc.
- Current Assignee Address: US CA Monrovia
- Agency: Morgan, Lewis & Bockius, LLP
- Agent Louis-Vu T. Nguyen; Christopher J. Betti
- Main IPC: C07K16/40
- IPC: C07K16/40 ; C07K16/28 ; C07K16/46 ; C12N15/63
Abstract:
The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
Public/Granted literature
- US20200317814A1 HETERODIMERIC ANTIBODIES THAT BIND ENPP3 AND CD3 Public/Granted day:2020-10-08
Information query
