Invention Grant
- Patent Title: Coil component
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Application No.: US16869934Application Date: 2020-05-08
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Publication No.: US11482372B2Publication Date: 2022-10-25
- Inventor: Ju Hwan Yang , Chang Hak Choi , Byeong Cheol Moon , Yong Hui Li , Byung Soo Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0166808 20191213
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/04 ; H01F27/24 ; H01F27/29

Abstract:
A coil component includes a body embedding a support substrate, an external electrode disposed on one surface of the body, and a coil portion disposed on the support substrate and including a lead-out pattern having one surface exposed to one end surface of the body abutting the one surface of the body. A connection electrode penetrates the lead-out pattern, extends to the external electrode, and has one surface exposed to the one end surface of the body. An intermetallic compound is disposed between the connection electrode and the lead-out pattern. The connection electrode includes a base resin, a plurality of metal particles disposed in the base resin, and a conductive connection portion surrounding the plurality of metal particles and in contact with the intermetallic compound.
Public/Granted literature
- US20210183561A1 COIL COMPONENT Public/Granted day:2021-06-17
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