- 专利标题: Membrane circuit board and manufacturing method thereof
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申请号: US17031662申请日: 2020-09-24
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公开(公告)号: US11482387B2公开(公告)日: 2022-10-25
- 发明人: Liu-Bing Cai , Li-Xiong Deng , Fu-Zhou Wei , Li-Qiang Chen , Xiao-Ping Wang
- 申请人: Primax Electronics Ltd.
- 申请人地址: TW Taipei
- 专利权人: Primax Electronics Ltd.
- 当前专利权人: Primax Electronics Ltd.
- 当前专利权人地址: TW Taipei
- 代理机构: Kirton McConkie
- 代理商 Evan R. Witt
- 优先权: CN202010876186.2 20200827
- 主分类号: H01H13/06
- IPC分类号: H01H13/06 ; H01H13/703 ; H01H13/705
摘要:
A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.
公开/授权文献
- US20220068575A1 MEMBRANE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日:2022-03-03
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