- 专利标题： Method of forming array substrate, array substrate and display device
-
申请号： US17040510申请日： 2020-03-18
-
公开(公告)号： US11482545B2公开(公告)日： 2022-10-25
- 发明人: Yonglian Qi , Chao Liu , Lianjie Qu , Hebin Zhao , Shan Zhang , Ning Jia , Guangdong Shi , Shuai Liu
- 申请人： BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址： CN Beijing; CN Beijing
- 专利权人： BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人： BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址： CN Beijing; CN Beijing
- 代理机构： McCoy Russell LLP
- 优先权： CN201910243617.9 20190328
- 国际申请： PCT/CN2020/080008 WO 20200318
- 国际公布： WO2020/192528 WO 20201001
- 主分类号： H01L27/12
- IPC分类号： H01L27/12 ; H01L25/075 ; G09G3/32
摘要：
A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.
公开/授权文献
信息查询
IPC分类:
